Study Subject(s): Engineering
Course Level: Undergraduate
Scholarship Provider: Curtin University of Technology Sarawak
Scholarship can be taken at: Malaysia
Eligibility:
- Must be a Sarawakian or of Sarawakian parentage (either parent must be a Sarawakian)
- Full time student admitted to the first year Engineering (any field) Degree Programme at the School of Engineering and Science, Curtin University of Technology Sarawak, Miri
- Currently not holding any scholarship/loan/financial assistance from any other organisation
- Minimum combined parents’ salaries/income not exceeding RM2,500 per month
- Must obtain at least 4A’s in SPM (credit in Bahasa Melayu, English and Mathematics) / at least 2A’s in STPM (pass in General Paper) / a minimum CGPA 2.75 for Certificate/Matriculation/Diploma
Scholarship Open for International Students: No
Scholarship Description: The Daiken Scholarship is Tenable for four (4) years and Amount of scholarship is RM10,000.00 (Ringgit Malaysia Ten Thousand) per academic year. Short-listed candidates will be called for interview.
How to Apply: By Post
Scholarship Application Deadline: 18 July 2011
Further Scholarship Information and Application
Categories: Malaysia, Scholarships, Scholarships in Asia Tags: Bahasa Melayu, Certificate Matriculation Diploma, cgpa, Course Level, financial assistance, General Paper, Malaysia, scholarship, scholarship application deadline, stpm
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